04:49 Jan 21, 2021 |
English to Polish translations [PRO] Tech/Engineering - Engineering (general) | |||||||
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2 | połączenie klinowe |
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wedge bonding |
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połączenie klinowe Explanation: . -------------------------------------------------- Note added at 6 hrs (2021-01-21 11:29:41 GMT) -------------------------------------------------- Jakiego rodzaju połączenia (kulkowe ang. ball bond, klinowe wedge bond) występują w efekcie zgrzewania termokompresyjngo - https://t.ly/9T2b |
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6 hrs |
Reference: wedge bonding Reference information: The wedge bonding process, on the other hand, utilizes ultrasonic energy and pressuredescribe the image to create a bond between the wire and the bond pad. When gold wire is used, wedge bonding uses temperatures up to 150 degrees C, and similar to ball bonding this technique is called thermosonic (T/S) bonding. The most predominant process for wedge bonding is a low temperature process or ambient temperature bonding, where aluminum wire is used to make the interconnection of the die and package. This “welding process” (either hot or cold) deforms the wire into a flat elongated shape of a wedge, however depending on the type of wedge tool used, the shape can sometimes have a cross groove (typically for 1 mil gold wire). Unlike ball bonding, the first bond for a wedge bond does not have a ball, which is why this wire bonding process is called wedge-wedge bonding. - https://www.palomartechnologies.com/blog/bid/206846/ball-bon... -------------------------------------------------- Note added at 6 hrs (2021-01-21 11:20:32 GMT) -------------------------------------------------- Wedge bonding utilizes a wedge tool to form the stitches on both ends, without the use of a ball for the first bond - https://www.palomartechnologies.com/processes/wire-bonding/w... |
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